In the production of multilayer parquet and laminate flooring, there are several similar production steps in which wood-based panels are divided into smaller formats.
Production of two-layer parquet: The base layer of two-layer parquet usually consists of a seven-layer plywood board with a thickness of 6 mm to 8 mm, which is purchased as a raw board in a standard format. The raw board is divided crosswise and lengthwise into strips of suitable size. The final dimension is only produced during the subsequent profiling process, so that at this stage particularly high precision is not yet required. Depending on the throughput and degree of automation of the production, the splitting can be done with a multi-blade saw (also: multi-blade circular saw or multi-rip saw), pressure beam saw or also with a sliding table saw.
Laminate flooring: A fibreboard is used as the carrier board for laminate flooring, either HDF or MDF. This board is usually large in size and must be brought to the correct size before coating. This is done in a dividing line. After coating, the board is ripped into individual flooring elements and then profiled. This second formatting step takes place successively in longitudinal and crosswise direction on multi-rip saws.
Multi-blade saw or multi-rip saw: Several saw blades on one shaft. High throughput, the entire raw panel is divided into strips of exact width in one pass.
Pressure beam saw: A single board or even a stack of several boards is held by the pressure beam. A sawing unit cutting from below moves through the board or stack and cuts off one strip at a time.
Sliding table saw: The raw panel lies on a sliding carriage, which is manually guided by an employee along a rip fence over a saw blade. Low investment with low output.
Dividing plant: Plant which divides panels or whole stacks of several panels one above the other according to the principle of a pressure beam saw. The boards are automatically manipulated with suction beams or robots.